SPEC NO: CDA0328
REV NO: V.1
DATE: OCT/25/2001
PAGE: 1 OF4
APPROVED : J. Lu
CHECKED :
DRAWN: M.F.CAI
Description
The Super Bright Yellow source color devices are made
with DH InGaAlP on GaAs substrate Light Emitting
Diode.
3.0x1.5mm SMD CHIP LED LAMP
APL3015SYC SUPER BRIGHT YELLOW
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
0.2(0.0079") unless otherwise noted.
3. Lead spacing is measured where the lead emerge package.
4. Specifications are subject to change without notice.
Package Dimensions
Features
!
3.0mmx1.5mm SMT LED, 1.4mm THICKNESS.
!
LOW POWER CONSUMPTION.
!
WIDE VIEWING ANGLE.
!
IDEAL FOR BACKLIGHT AND INDICATOR.
!
VARIOUS COLORS AND LENS TYPES AVAILABLE.
!
INNER LENS TYPE.
!
PACKAGE : 2000PCS / REEL.
SPEC NO: CDA0328
REV NO: V.1
DATE: OCT/25/2001
PAGE: 2 OF4
APPROVED : J. Lu
CHECKED :
DRAWN: M.F.CAI
Electrical / Optical Characteristics at T
A
=25
C
Absolute Maximum Ratings at T
A
=25
C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Selection Guide
Note:
1.
1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
e
c
i
v
e
D
e
c
i
v
e
D
e
c
i
v
e
D
e
c
i
v
e
D
e
c
i
v
e
D
.
p
y
T
.
p
y
T
.
p
y
T
.
p
y
T
.
p
y
T
.
x
a
M .
x
a
M .
x
a
M .
x
a
M
.
x
a
M
s
ti
n
U
s
ti
n
U
s
ti
n
U
s
ti
n
U
s
ti
n
U
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
k
a
e
p
h
t
g
n
e
l
e
v
a
W
k
a
e
P
w
o
ll
e
Y
t
h
g
ir
B
r
e
p
u
S
0
9
5
m
n
A
m
0
2
=
F
I
D
h
t
g
n
e
l
e
v
a
W
e
t
a
n
i
m
o
D
w
o
ll
e
Y
t
h
g
ir
B
r
e
p
u
S
8
8
5
m
n
A
m
0
2
=
F
I
2
/
1
h
t
d
i
w
fl
a
H
e
n
i
L
l
a
r
t
c
e
p
S
w
o
ll
e
Y
t
h
g
ir
B
r
e
p
u
S
8
2
m
n
A
m
0
2
=
F
I
C
e
c
n
a
ti
c
a
p
a
C
w
o
ll
e
Y
t
h
g
ir
B
r
e
p
u
S
5
2
F
p
z
H
M
1
=
f;
V
0
=
F
V
V
F
e
g
a
tl
o
V
d
r
a
w
r
o
F
w
o
ll
e
Y
t
h
g
ir
B
r
e
p
u
S
0
.
2
5
.
2
V
A
m
0
2
=
F
I
I
R
t
n
e
r
r
u
C
e
s
r
e
v
e
R
w
o
ll
e
Y
t
h
g
ir
B
r
e
p
u
S
0
1
A
u
V
5
=
R
V
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
w
o
ll
e
Y
t
h
g
i
r
B
r
e
p
u
S
w
o
ll
e
Y
t
h
g
i
r
B
r
e
p
u
S
w
o
ll
e
Y
t
h
g
i
r
B
r
e
p
u
S
w
o
ll
e
Y
t
h
g
i
r
B
r
e
p
u
S
w
o
ll
e
Y
t
h
g
i
r
B
r
e
p
u
S
s
ti
n
U
s
ti
n
U
s
ti
n
U
s
ti
n
U
s
ti
n
U
n
o
it
a
p
i
s
s
i
d
r
e
w
o
P
5
2
1
W
m
t
n
e
r
r
u
C
d
r
a
w
r
o
F
C
D
0
3
A
m
]
1
[
t
n
e
r
r
u
C
d
r
a
w
r
o
F
k
a
e
P
5
7
1
A
m
e
g
a
tl
o
V
e
s
r
e
v
e
R
5
V
e
r
u
t
a
r
e
p
m
e
T
g
n
it
a
r
e
p
O
0
4
-
5
8
+
o
T
C
C
e
r
u
t
a
r
e
p
m
e
T
e
g
a
r
o
t
S
0
4
-
5
8
+
o
T
C
C
.
o
N
t
r
a
P
.
o
N
t
r
a
P
.
o
N
t
r
a
P
.
o
N
t
r
a
P
.
o
N
t
r
a
P
e
c
i
D e
c
i
D e
c
i
D e
c
i
D e
c
i
D
e
p
y
T
s
n
e
L
e
p
y
T
s
n
e
L
e
p
y
T
s
n
e
L
e
p
y
T
s
n
e
L
e
p
y
T
s
n
e
L
)
d
c
m
(
v
I
)
d
c
m
(
v
I
)
d
c
m
(
v
I
)
d
c
m
(
v
I
)
d
c
m
(
v
I
A
m
0
2
@
g
n
i
w
e
i
V
g
n
i
w
e
i
V
g
n
i
w
e
i
V
g
n
i
w
e
i
V
g
n
i
w
e
i
V
e
l
g
n
A
.
n
i
M .
n
i
M .
n
i
M .
n
i
M .
n
i
M
.
p
y
T
.
p
y
T
.
p
y
T
.
p
y
T
.
p
y
T
2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2
C
Y
S
5
1
0
3
L
P
A
)
P
l
A
a
G
n
I
(
W
O
L
L
E
Y
T
H
G
I
R
B
R
E
P
U
S
R
A
E
L
C
R
E
T
A
W
0
4
0
5
1
0
7
SPEC NO: CDA0328
REV NO: V.1
DATE: OCT/25/2001
PAGE: 4 OF4
APPROVED : J. Lu
CHECKED :
DRAWN: M.F.CAI
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
APL3015SYC
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
PDF 
ZIP